Product Details
Brand Brownells
UPC 050806022836
Description
COPPER BOND FLUX The Brownells Copper Bond Flux is specifically formulated for soldering applications within the 600AdegF to 800AdegF temperature range, making it an ideal companion for Hi-Temp Hi-Force 44(TM) Solder. This flux flows effortlessly into tight spots, ensuring thorough coverage and strong, reliable joints. Post-soldering cleanup is simplified, as the residue can be easily removed with warm water. Key Features: Optimal Temperature Range: Designed for soldering between 600AdegF and 800AdegF, aligning perfectly with Hi-Temp Hi-Force 44(TM) Solder requirements. Efficient Flow: Penetrates tight spaces to ensure comprehensive flux coverage and robu Mfg: Brownells